ISTFA 2025

NenoVision

ISTFA 2025

Meet us at ISTFA 2025 in Pasadena, California (November 16-20) - the leading global event for the microelectronics failure analysis community!

We’re excited to announce that NenoVision will participate in ISTFA 2025, taking place November 16-20 in Pasadena, California.

As the leading event in microelectronics and semiconductor failure analysis, ISTFA is the place where innovation meets practice - and that’s exactly where NenoVision belongs. With our LiteScope AFM-in-SEM technology, we bring a unique correlative approach that bridges structural, electrical, and mechanical insights directly inside the SEM.

This year, we’re especially thrilled to highlight our collaboration with NVIDIA, showcasing how integrated AFM-in-SEM workflows are transforming advanced semiconductor failure analysis.

Visit us to learn how LiteScope AFM-in-SEM enables in-situ nanoscale electrical, mechanical, and topographical characterization directly inside the SEM - helping researchers and semiconductor manufacturers push the boundaries of failure analysis and device reliability.

Meet us at booth #412!

When?

16-20 November 2025

Where?

Pasadena, California, USA

NenoVision Talks at ISTFA

Jan Neuman will present a tutorial on the benefits of the correlative in-situ AFM-in-SEM technique for advanced semiconductor failure analysis and material characterization, prepared in collaboration with Arizona State University and Thermo Fisher Scientific.

Industry highlight: NVIDIA & Chuan Zhang will present a talk "Streamlined Advanced Semiconductor FA Through In-Situ CAFM and Plasma FIB Integration" showcasing AFM-in-SEM use-cases on NVIDIA samples using our LiteScope. .

Tutorial: Correlative In-Situ AFM-in-SEM technique for Advanced Semiconductor Failure Analysis and Material Characterization

Sunday, November 16, 2025: 3:50 PM

3 (Pasadena Convention Center)

Dr. Jan Neuman , NenoVision s. r. o., Brno, Jihomoravsky kraj, Czech Republic

Mr. Ondřej Novotný , NenoVision s. r. o., Brno, Jihomoravsky kraj, Czech Republic

Mrs. Veronika Hegrová , NenoVision s. r. o., Brno, Jihomoravsky kraj, Czech Republic

Mr. Lukáš Kormoš , Thermo Fisher Scientific, Brno, Czech Republic, Thermo Fisher Scientific, Brno, Jihomoravský kraj, Czech Republic

Mr. Libor Strakoš , Thermo Fisher Scientific, Brno, Jihomoravský kraj, Czech Republic

Dr. Claudiu Colbea , Thermo Fisher Scientific, Brno, Jihomoravský kraj, Czech Republic

Dr. Adam Stokes , Thermo Fisher Scientific, Hillsboro, OR

Mr. Md Ashiqur Rahman Laskar , Arizona State University, Tempe, AZ

Prof. Umberto Celano , Arizona State University, Tempe, AZ

Rosalinda Ring , NenoVision s. r. o., Brno, Jihomoravsky kraj, Czech Republic

Talk: Streamlined Advanced Semiconductor FA Through In-Situ CAFM and Plasma FIB Integration

Monday, November 17, 2025: 11:20 AM

2 (Pasadena Convention Center)

Dr. Chuan Zhang , NVIDIA Corporation, Santa Clara, CA

Dr. Jane Y. Li , NVIDIA Corporation, Santa Clara, CA

Mr. Radek Dao , NenoVision s. r. o., Brno, Czech Republic

Ms. Rose Ring , NenoVision s. r. o., Brno, Czech Republic

Summary:

This work presents a streamlined and efficient failure analysis methodology for advanced integrated circuits by integrating an in-situ CAFM-pFIB platform. This approach eliminates repeated vacuum cycles and manual transfers, significantly reducing analysis time while preserving pristine surfaces for high-quality CAFM imaging. The system's effectiveness was validated through case studies, including one on a stacked-die package where pFIB milling was used not only for in-situ delayering across multiple layers but also for creating a grounding path to enable successful CAFM localization of leaky gate defects. This integrated platform also made possible a novel Scanning EBIC Microscopy technique for mapping subsurface junction behavior, offering new capabilities for nanoscale defect localization in complex semiconductor technologies.