Enhanced component performance through subsurface conditioning in BTA deep hole drilling

Enhanced component performance through subsurface conditioning in BTA deep hole drilling

Explore how subsurface conditioning in BTA deep hole drilling enhances component performance. Through the analysis of drilling factors and advanced detection methods, researchers strive to enhance surface integrity and ensure the reliability of critical components.

For deep holes requiring high length-to-diameter ratios (l/D > 10) and large diameters (D > 40 mm), the Boring and Trepanning Association (BTA) process is commonly applied in aerospace and petrol exploration. This study investigates the correlation between BTA deep hole drilling and surface integrity, analyzing the impact of feed, cutting speed, and dynamic process disturbances.


The focus is on white etching layers (WEL), examined through traditional techniques and innovative micromagnetic methods, including Magnetic Barkhausen noise (MBN) analysis for rapid WEL detection. To delve deeper into the micrometer-range magnetic domain structure, selected specimens underwent MFM investigations using the piezo-based AFM-in-SEM LiteScope by NenoVision. MFM investigations utilized magnetic Akiyama probes as two-pass measurements, acquiring topography in the first pass and mapping phase changes in the second pass.


AFM investigations were conducted under vacuum inside the Zeiss Crossbeam 550 to identify the region of interest and ensure stable probe oscillation. This comprehensive approach lays the foundation for controlled subsurface conditioning in BTA deep hole drilling.


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