Defect analysis of a CMOS-type chip
![Defect analysis of a CMOS-type chip](https://webadmin.nenovision.com/media/images/application/sc2_cmos_3.png?width=900&height=0&rmode=min&quality=75&token=K1vKRncMWNI3T2006wdTIdy6fZYlV5VSfskugOtufUg%3D)
Precise analysis of defects is crucial in the production and characterisation of semiconductorsmultimodal analysis on a nanoscale. Therefore, in-situ multimodal analysis on a nanoscale level is of high interest.
For example, polished tungsten plugs in a cross-section of CMOS-type chips were simultaneously analysed by AFM, SEM and KPFM techniques. The measurement showed that the contact potential of the pins alternates between two values.
Measurement modes: KPFM, Topography
LiteScope benefits:
- correlated AFM, KPFM and SEM analysis
- easy localisation to the region of interest
- essential for fabrication and functionality of semiconductor structures
Sample courtesy of Michael Walther, X-FAB
See also
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